Erick Spory will be presenting at the 22nd Microelectronics and Packaging Conference (EMPC) and Exhibition September 16-19, 2019 in Pisa, Italy.
Mr. Spory will be presenting "High-Temperature Inter-Cavity Silicon Interposer Substrate for Multi-Chip Module Assembly".
EMPC-2019 in Pisa offers the best of microelectronics packaging and interconnection technologies, providing top quality coverage of technological innovation in this field. This is the established international forum for engineers working in the field and others wanting to learn from this leading event.
From the most Recent Rapid Innovation (RIF) Funding Acceptance Award, GCI and The United States Air Force Team together to resolve DoD IC Obsolescence