GCI Trademarks DER™

June 29, 2017

 


The United States Patent and Trademark Office issued Global Circuit Innovations the trademark for DER™ (Die Extraction and Reassembly/Repackaging) on May 30th, 2017, which incorporates several GCI proprietary integrated circuit technology flows.
 
Registration No. 5,215,549 Class 9:  Electronic chips for the manufacture of integrated circuits.

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