GCI to attend IIOM Conference in Bristol, UK
June 17th, 2017 Global Circuit Innovations CEO/CTO Erick Spory will be presenting at this year's IIOM Conference in Bristol, United Kingdom June 20-22, 2017. Mr. Spory will be discussing "Advances in Die Extraction and Re-packaging for Obsolete Semiconductors". "We are excited about another great opportunity to educate the IC obsolescence solutions community about our proprietary Die Extraction and Re-packaging Process (DER™) along with ENIPEG Plating (DEER™). These advances in technology for IC obsolescence are a
game changer", said Erick Spory of GCI.