GCI to attend IIOM Conference in Bristol, UK

June 17, 2017

June 17th, 2017

Global Circuit Innovations CEO/CTO Erick Spory will be presenting at this year's IIOM Conference in Bristol, United Kingdom June 20-22, 2017. Mr. Spory will be discussing "Advances in Die Extraction and Re-packaging for Obsolete Semiconductors".

"We are excited about another great opportunity to educate the IC obsolescence solutions community about our proprietary Die Extraction and Re-packaging Process (DER™) along with ENIPEG Plating (DEER™). These advances in technology for IC obsolescence are a

game changer", said Erick Spory of GCI. 

 

 

Please reload

Featured Posts

GCI attends 448th SCCI Industry Day

April 26, 2019

1/6
Please reload

Recent Posts

March 25, 2020

December 10, 2018

Please reload

Search By Tags

4182 Center Park Drive

Colorado Springs, CO 80916

+1 719 573-6777

© 2020 GCI-GLOBAL