GCI to attend IIOM Conference in Bristol, UK

June 17, 2017

June 17th, 2017

Global Circuit Innovations CEO/CTO Erick Spory will be presenting at this year's IIOM Conference in Bristol, United Kingdom June 20-22, 2017. Mr. Spory will be discussing "Advances in Die Extraction and Re-packaging for Obsolete Semiconductors".

"We are excited about another great opportunity to educate the IC obsolescence solutions community about our proprietary Die Extraction and Re-packaging Process (DER™) along with ENIPEG Plating (DEER™). These advances in technology for IC obsolescence are a

game changer", said Erick Spory of GCI. 



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