Innovative Authorized Reverse Engineering IC Solutions
for Obsolescence and High Temperature Environments
GCI to attend IIOM Conference in Bristol, UK
June 17, 2017
June 17th, 2017 Global Circuit Innovations CEO/CTO Erick Spory will be presenting at this year's IIOM Conference in Bristol, United Kingdom June 20-22, 2017. Mr. Spory will be discussing "Advances in Die Extraction and Re-packaging for Obsolete Semiconductors". "We are excited about another great opportunity to educate the IC obsolescence solutions community about our proprietary Die Extraction and Re-packaging Process (DER™) along with ENIPEG Plating (DEER™). These advances in technology for IC obsolescence are a
game changer", said Erick Spory of GCI.
From the most Recent Rapid Innovation (RIF) Funding Acceptance Award, GCI and The United States Air Force Team together to resolve DoD IC Obsolescence