Innovative Authorized Reverse Engineering IC Solutions
for Obsolescence and High Temperature Environments
From the most Recent Rapid Innovation (RIF) Funding Acceptance Award, GCI and The United States Air Force Team together to resolve DoD IC Obsolescence
February 1, 2017
Global Circuit Innovations (GCI) is pleased to announce that the United States Air Force (USAF) has released a Broad Agency announcement for GCI's Die Extraction and Repackaging (DER) Rapid Innovation Funding (RIF) proposal acceptance, which will provide a quick reaction and low-cost readiness approach to resolve up to 25 Integrated Circuit (IC) obsolescence issues that contribute to, or are solely responsible for, existing and future Mission Impaired Capability Awaiting Parts (MICAP) events. GCI locates franchised identical donor material or works with the Original Component Manufacturer's (OCM) Field Application Engineer to identify the best franchised bare die inventory or extracted die options to repackage and qualify in the desired package footprint.
Ed Odette, GCI VP Business Development, stated that “the Rapid Innovation Funding (RIF) covers the cost for development and qualification testing for approved candidate parts.” The USAF and GCI are seeking obsolete IC part types across DoD programs that are affecting production and sustainment for DoD equipment weapon systems. The USAF and GCI have also approached the DMSMS committee to propose hosting a panel at the November DMSMS 2017 conference in Orlando to identify additional programs, processes, and parts that could benefit from a better understanding of GCI’s technology as an alternative to redesign, ultimately resulting in significant cost savings.