Innovative Authorized Reverse Engineering IC Solutions
for Obsolescence and High Temperature Environments
First of a 4 Part Series - The Driving Forces Behind Die Extraction for Reassembly – Increased Temperature Reliability and Solutions for Obsolescence
July 10, 2015
Increased Temperature Reliability-
Specialty semiconductor applications, like those in down-hole drilling, typically add a requirement of high temperature reliability to device performance. A problem facing these industries is accessibility to bare die integrated circuits available for use in either monolithic substrates, or multi chip module (MCM) products for extreme temperature applications (>150C). Silicon functionality at elevated temperatures is typically acceptable, but the typical lower cost commercial OCM packaging may cause connectivity degradation over time at temperature due to gold bond wire usage and non-hermetic plastic packaging. Bare die availability and purchase can help to mitigate connectivity reliability issues through the use of aluminum bond wire (when the pitch allows) and ceramic or metal hermetic packaging, but bare die are not generally available in small quantities, if at all. In some cases, the original aluminum pads of the die can be plated with electroless nickel to eliminate the possibility of either Horsting or Kirkendall voiding when subsequently bonded with gold bond wire.
Die extraction is an alternative method of supply for these applications. Repackaging of extracted die into hermetically sealed, ceramic packages, removes plastic package halide acceleration factors that lead to Horsting voiding, and ultimately improve bond reliability at elevated temperatures (150C-250C).
For additional information on this solution send your request to email@example.com or call 719-573-6777.
From the most Recent Rapid Innovation (RIF) Funding Acceptance Award, GCI and The United States Air Force Team together to resolve DoD IC Obsolescence