Innovative Authorized Reverse Engineering IC Solutions
for Obsolescence and High Temperature Environments
Observations From Offshore Technology Conference
May 15, 2015
Although the Oil & Gas industry is currently experiencing reductions in drilling due to dramatically lower oil prices, one could barely notice based on the flurry of activity and significant crowd discussions in the OTC exhibits and technical presentations. By 11:00 am Tuesday, the aisles were packed at the NRG Center, one of three large exhibit halls at the conference. The vast outdoor OTC Parkway, displaying oil field equipment too large to be placed inside one of the pavilions, was also very impressive and well attended. Luckily the OTC smartphone application made it far easier to navigate and target company and technology exhibits of interest.
One of the many advantages of a large conference such as OTC is the increased ability to meet face to face with senior level staff that would otherwise be difficult to reach. The larger organizations appeared to typically staff their exhibits with marketing and product managers. The presence and role of senior executives in these exhibits was more to renew relationships and directly meet with their largest customers. In contrast, the next tier suppliers often had their key engineers or business development leaders in the booth. I routinely found that these individuals are faced with issues relating to performance of electronics at higher temperatures or obsolete semiconductors. GCI’s die extraction and high-temperature hermetic/ceramic reassembly capabilities were of genuine interest to those in attendance with electronic backgrounds.
Note to self – wear more comfortable walking shoes and trade the suit for a golf shirt and slacks next year…
From the most Recent Rapid Innovation (RIF) Funding Acceptance Award, GCI and The United States Air Force Team together to resolve DoD IC Obsolescence