Innovative Authorized Reverse Engineering IC Solutions
for Obsolescence and High Temperature Environments
Solving FPGA Availability Issues Cost Effectively Through Die Harvesting & Packaging - A CMSE 2014 Presentation
June 5, 2014
Colorado Springs, CO — January 2014 — Erick M. Spory, CEO of Global Circuit InnovationsTM (GCI) was a presenter at the CMSE conference.
The presentation, "Solving FPGA Availability Issues Cost Effectively Through Die Harvesting & Packaging" addresses supply chain counterfeits and obsolete issues in the lifetimes of commercial integrated circuits, as well as military and industrial platforms while offering solutions for die extraction of available components and re-assembly into desired footprint and/or modified bond out: locating available die, map signals, reconstructing new substrates, removing die, re-attaching die, wire bond, encapsulate, ball substrate and test.
Additional information on this presentation can be found at