Global Circuit InnovationsTM Announces an Updated Website
Colorado Springs, CO — 17 December 2013 — Global Circuit Innovations, Inc. (GCI) has announced today that they have released an updated website. URL: http://www.GCI-‐Global.com
Erick Spory, GCI’s founder and CEO, said, “Our technology, engineering and volume production capabilities can solve many of the most difficult issues faced by electronic system engineers in the defense and industrial markets. I believe that this updated website better communicates the products and technologies that GCI offers to our existing and prospective customers.”
Global Circuit Innovations, Inc.
About Global Circuit InnovationsTM
Global Circuit InnovationsTM (GCI) uses advanced technologies to provide state of the art Integrated Circuit (IC) products and services for defense, industrial and commercial electronics applications with the highest possible levels of reliability and survivability.
GCI’s current products and services include: die extraction from any plastic or hermetic package without damaging the die and subsequent reassembly of these removed die if desired into any package, environmentally hardened Integrated Circuit (IC) products with 250X increased survivability at 250C in high, die thinning services, Integrated Circuit (IC) assembly, hybrid module design and manufacture, Accelerated Prototype Development (APD) with quick-‐turn bare-‐dice or removed and reassembled dice, IC and electronic system failure analysis, PC board design, IC and PC board reverse engineering and manufacturing, Conductive Diamond Plating (CDP), as well as design and manufacture of 50 GHz IC test sockets.
It is the vision of Global Circuit InnovationsTM (GCI) to consistently be the top choice for defense obsolescence solutions, high-‐temperature electronic solutions for oil well drilling (i.e., downhole) applications and other high-‐ temperature and/or highly rugged applications, die removal and reassembly, environmentally hardened ICs,
hybrids and PC boards, IC assembly, Failure Analysis, Conductive Diamond Plating (CDP) as well as other related engineering services.
Founded in 2006, Global Circuit Innovations is privately held and based in Colorado Springs, CO.
Our Innovations are Your Solutions™
For more information, visit: http://www.GCI-‐Global.com
Or contact us at: +1 (719) 573-‐6777
Or contact us at: Contact@GCI-‐Global.com
© 2013 Global Circuit InnovationsTM. All rights reserved. Trademarks and brands are the property of their respective owners.