Global Circuit InnovationsTM Announces an Updated Website

December 30, 2013

Colorado Springs, CO — 17 December 2013 — Global Circuit Innovations, Inc. (GCI) has announced today that they have released an updated website.   URL:  http://www.GCI-­‐Global.com

 

Erick Spory, GCI’s founder and CEO, said, “Our technology, engineering and volume production capabilities can solve many of the most difficult issues faced by electronic system engineers in the defense and industrial markets. I believe that this updated website better communicates the products and technologies that GCI offers to our existing and prospective customers.”

 

Contact Info:

Global Circuit Innovations, Inc.

 

http://www.GCI-­‐Global.com

 

About Global Circuit InnovationsTM

Global  Circuit  InnovationsTM  (GCI)  uses  advanced  technologies  to  provide  state  of  the  art  Integrated  Circuit  (IC) products  and  services  for  defense,  industrial  and  commercial  electronics  applications  with  the  highest  possible levels of reliability and survivability.

 

GCI’s current products and services include: die extraction from any plastic or hermetic package without damaging the die and subsequent  reassembly  of these removed die if desired into any package, environmentally  hardened Integrated Circuit (IC) products with 250X increased survivability at 250C in high, die thinning services, Integrated Circuit  (IC)  assembly,  hybrid  module  design  and  manufacture,  Accelerated  Prototype  Development  (APD)  with quick-­‐turn bare-­‐dice or removed and reassembled dice, IC and electronic system failure analysis, PC board design, IC and PC board reverse engineering and manufacturing,  Conductive Diamond Plating (CDP), as well as design and manufacture of 50 GHz IC test sockets.

 

It is the vision  of Global  Circuit  InnovationsTM  (GCI) to consistently  be the top choice  for defense  obsolescence solutions,  high-­‐temperature  electronic  solutions  for oil well drilling (i.e., downhole)  applications  and other high-­‐ temperature  and/or  highly  rugged  applications,  die  removal  and  reassembly,  environmentally  hardened  ICs,

 

hybrids and PC boards, IC assembly,  Failure Analysis,  Conductive  Diamond  Plating (CDP) as well as other related engineering services.

 

Founded in 2006, Global Circuit Innovations is privately held and based in Colorado Springs, CO.

 

Our Innovations are Your Solutions™

 

For more information, visit:   http://www.GCI-­‐Global.com

 

Or contact us at:                       +1 (719) 573-­‐6777

 

Or contact us at:                       Contact@GCI-­‐Global.com

 

© 2013 Global Circuit InnovationsTM. All rights reserved. Trademarks and brands are the property of their respective owners.

 

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