Terry Dillahunty Joins Global Circuit Innovations

Colorado Springs, CO — 25 November 2013 — Global Circuit Innovations, Inc. (GCI) (www.GCI-­‐Global.com) announced today that Terry Dillahunty has joined the firm to expand GCI’s market penetration, key account development and sales channel management. Terry comes with many years of experience in Defense, Aerospace, Industrial and Semiconductor markets having held a variety of key business positions with Kaman Aerospace and most recently Atmel Corporation.

As GCI’s Director of Business Development, Terry’s successful track record of expanding sales channels, recruiting independent sales representatives and building strong customer relationships will help the company address the increased demand in it’s product technology and services. Terry adds, “I am truly excited about the opportunity to expand GCI’s customer base and especially the critical need to provide cost saving solutions for DOD programs facing severe IC obsolescence issues with semiconductor suppliers.”

Erick Spory, GCI’s founder and CEO, said “Terry’s experience and skill set comes at perfect time for GCI as we have seen rapid growth in our innovative high temperature / high reliability solutions for the Downhole Gas and Oil drilling industry. Our technology, engineering and volume production capabilities can solve many of the most difficult issues faced by electronic system engineers. I am pleased to have Terry join us and confident he will play a key role in expanding GCI’s business growth.”

Contact Info:

Global Circuit Innovations, Inc.


Terry Dillahunty, Director of Business Development

Email: Terry.Dillahunty@GCI-­‐Global.com

Phone: 719-­‐573-­‐6777 x 108

About Global Circuit InnovationsTM

Global Circuit InnovationsTM (GCI) uses advanced technologies to provide state of the art Integrated Circuit (IC)

products and services for defense, industrial and commercial electronics applications with the highest possible levels of reliability and survivability.

GCI’s current products and services include: die extraction from any plastic or hermetic package without damaging the die and subsequent reassembly of these removed die if desired into any package, environmentally hardened Integrated Circuit (IC) products with 250X increased survivability at 250C in high, die thinning services, Integrated Circuit (IC) assembly, hybrid module design and manufacture, Accelerated Prototype Development (APD) with quick-­‐turn bare-­‐dice or removed and reassembled dice, IC and electronic system failure analysis, PC board design, IC and PC board reverse engineering and manufacturing, Conductive Diamond Plating (CDP), as well as design and manufacture of 50 GHz IC test sockets.

It is the vision of Global Circuit InnovationsTM (GCI) to consistently be the top choice for defense obsolescence solutions, high-­‐temperature electronic solutions for oil well drilling (i.e., downhole) applications and other high-­‐ temperature and/or highly rugged applications, die removal and reassembly, environmentally hardened ICs, hybrids and PC boards, IC assembly, Failure Analysis, Conductive Diamond Plating (CDP) as well as other related engineering services.

Founded in 2006, Global Circuit Innovations is privately held and based in Colorado Springs, CO.

Our Innovations are Your Solutions™

For more information, visit: http://www.GCI-­‐Global.com

Or contact us at: +1 (719) 573-­‐6777

Or contact us at: Contact@GCI-­‐Global.com

© 2013 Global Circuit InnovationsTM. All rights reserved. Trademarks and brands are the property of their respective owners.

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