Erick Spory, CEO of Global Circuit InnovationsTM to Speak at DMSMS Conference in Kissimmee, FL on 05

Colorado Springs, CO — 28 October 2013 — Erick Spory, CEO of Global Circuit InnovationsTM (GCI) will speak at the DMSMS conference in Kissimmee, FL on Thu 05 December 2013 at 9:30AM (EST). The title of the paper that Erick will present is: FPGA Footprint and/or Vendor Conversion Through Die Harvesting, Mapping, and Reassembly to Avoid Complete System Redesign


Colorado Springs, CO — 29 August 2011 — Erick Spory, CEO of Global Circuit InnovationsTM (GCI) will speak at the DMSMS conference in Hollywood, FL at 4PM (EDT) on Wed 31 August 2011.


DMSMS stands for “Diminishing Manufacturing Sources and Material Shortages”. DMSMS is defined as: "The loss or impending loss of manufacturers of items or suppliers of items or raw materials."

“DMSMS is a significant and growing issue with semiconductors of Integrated Circuits (ICs),” says Erick Spory, CEO of Global Circuit InnovationsTM. “IC lifetimes are driven by the commercial market which is driven primarily by cost-effective performance. Therefore most commercial ICs complete their product life cycle and become obsolete in two to three years after introduction. Meanwhile military systems, which typically have 20-30 year product lifetimes, increasingly utilize Commercial-Off-The-Shelf (COTS) ICs. It is not unusual that 10% to 50% of the IC components in a military system are already obsolete at the time that a military system is released to production. Global Circuit InnovationsTM (GCI) offers the option to remove readily available die from an undesired package format and then reassemble them into the package that is required by the application. Additionally GCI can provide these ICs in a hermetic package even if it was only ever commercially available in a plastic (non-hermetic) package.”

This can be done in days, not weeks or months.

“Using our proprietary techniques and materials, we can remove any die from any package with absolutely no damage to the die and then reassemble those previously removed dice into any hermetic IC package. We typically see IC product lifetimes as much as 250X longer than those of identical die in their Original Equipment Manufacturer (OEM) plastic packages under identical lifetest conditions at 250C,” says Charlie Beebout, VP of Marketing and Sales of Global Circuit InnovationsTM. “Additionally the bond pull and die shear strengths as tested to MIL-STD-883H conditions are identical to those of the OEM.”

Please plan to attend the DMSMS conference in Hollywood, FL and hear the Global Circuit InnovationsTM presentation on resolving DMSMS issues. Registration is still available at the time of the conference.

Contact Info:

Global Circuit Innovations, Inc. http://www.GCI-­‐

About Global Circuit InnovationsTM Global Circuit InnovationsTM (GCI) uses advanced technologies to provide state of the art Integrated Circuit (IC) products and services for defense, industrial and commercial electronics applications with the highest possible levels of reliability and survivability.

GCI’s current products and services include: die extraction from any plastic or hermetic package without damaging the die and subsequent reassembly of these removed die if desired into any package, environmentally hardened Integrated Circuit (IC) products with 250X increased survivability at 250C in high, die thinning services, Integrated Circuit (IC) assembly, hybrid module design and manufacture, Accelerated Prototype Development (APD) with quick-­‐turn bare-­‐dice or removed and reassembled dice, IC and electronic system failure analysis, PC board design, IC and PC board reverse engineering and manufacturing, Conductive Diamond Plating (CDP), as well as design and manufacture of 50 GHz IC test sockets.

It is the vision of Global Circuit InnovationsTM (GCI) to consistently be the top choice for defense obsolescence solutions, high-­‐temperature electronic solutions for oil well drilling (i.e., downhole) applications and other high-­‐ temperature and/or highly rugged applications, die removal and reassembly, environmentally hardened ICs, hybrids and PC boards, IC assembly, Failure Analysis, Conductive Diamond Plating (CDP) as well as other related engineering services.

Founded in 2006, Global Circuit Innovations is privately held and based in Colorado Springs, CO.

Our Innovations are Your Solutions™

For more information, visit: http://www.GCI-­‐

Or contact us at: +1 (719) 573-­‐6777

Or contact us at: Contact@GCI-­‐

© 2013 Global Circuit InnovationsTM. All rights reserved. Trademarks and brands are the property of their respective owners.

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