TECHNOLOGY + SOLUTIONS
Reverse Engineering Solutions for Obsolescence
DER™ (Conventional Die Extraction & Re-packaging)
If one Package or Footprint is Obsolete, but the Needed Die can still be Located in Another Package Footprint, the Die can be Extracted and Re-packaged as Needed to meet the Target Footprint Requirement (DER™)
CERAMIC FLATPACK
PLASTIC PQFP
FRANCHISED DONOR IC DEVICE
OR THE DER™PROCESS
CAN BE USED TO
INVENTORY FUNCTIONAL DIE
MULTI-CHIP
MODULE
EXTRACTED DIE
CERAMIC CQFP
GCI'S DER™ TECHNOLOGY UP CLOSE
EXTRACTION TECHNOLOGY PROVIDES VERY CLEAN FRONT-SIDE AND BACK-SIDE SURFACES
DER™ RELIES ON CHEMICAL AND MECHANICAL PROCESSES WHICH ARE NO MORE AGGRESSIVE
THAN THOSE USED DURING WAFER FABRICATION
DIE BACK-SIDE SURFACE FREE OF CONTAMINANTS
AND RETURNED TO ORIGINAL MIRROR FINISH
EXTREMELY CLEAN BOND PADS
NO INADVERTENT ETCHING
DIE SURFACE FREE OF
CONTAMINANTS
Die Extraction and Re-packaging Considerations
- What is the End Application? (Bare Die, Hybrid, Monolithic)
-DER™ Flow: Original Package, Target Package Selections, Bond Map, Extraction, Re-Package, Test
New Bond Mapping Options for Same Die
- Multiple Chip Configurations for the Same Die Can Be Achieved with Optional Bondouts
-Plastic SOIC to Ceramic TSOP (Hermetic)
Franchised Donor SOIC
X-RAY IN Y DIRECTION
X-RAY IN
Z DIRECTION
EXTRACTED DIE
NEW BOND MAP
DIE ATTACHED
AND BONDED
FINAL CERAMIC
SOIC
Note 4 Bond Options For Conventional, Compound Bonding:
Red: Originally Non-Bonded Pad Still Not Bonded
Green: Originally Non-Bonded Pad Now Bonded
Yellow: Previously Bonded Pad Now Not Bonded
Pink: Previously Bonded Pad With a New Compound Bond
What Sets GCI Apart?
GCI has developed a proprietary technology superior to our
extraction re-packaging competitors.
DEER™ Reliability Improvements - Pad Re-Plating
Pad Re-Conditioning Using Gold Ball Removal Followed by ENEPIG
(Electroless Nickel, Electroless Palladium, Immersion Gold) Die PatPlating
-Potentially Poor Original Ball Bond Quality/Reliability is Removed
-Subsequent Bonding is Non-Compound with Highly Consistent and Reliable Bond Pull Strength
-New Bond Pad Surface Eliminates Possibility of Kirkendall Voiding with Gold Bond Wire at Operating Temperatures Above 150°C.
General Appearance of Kirkendall
or Horsting Voiding at Bond Pad
Location
Specifically, at Gold Ball to
Aluminum Bond Pad Interface, the
following Intermetallic Componds
can be formed:
Au5Al2, Au4Al, Au2Al, AuAl2
ILLUSTRATION of ENEPIG
PAD PLATING
OPTICAL PHOTO OF ACTUAL
ENEPIG PLATED DIE PAD
Process Flow for Re-Conditioning Following Extraction
-Targeted Thickenesses: 4 um Ni, 0.25 um Pd, 0.04 um AU
DEER™ Gold Ball Removal, Pad Re-Plating, and Re-bonding
with Electroless Ni/Pd/Au Process (ENEPIG)
Aluminum Pad Reconditioning for an Extracted Die (Target Total Plate Up is 4-5 um)
Technical Papers/Presentations
DMSMS 2018 Presentation "Obsolescence Solutions
without System Redesign"
DMSMS 2018 Poster for
Authorized Reverse Engineered
Solutions for Obsolescence
DMSMS 2018 Poster for
Circuit Card Assembly
AA&S "Unique Solutions to Obsolete ICs Using Die Extraction and Repackaging DER™"
SMTA Electronics in Harsh Environments
Conference "Increasing High-Temperature Reliability of Plastic ICs Using Die Extraction
and Gold Ball Removal, and ENEPIG Die Pad Plating (DEER™)"
DMSMS 2017 Presentation "A How To Guide on Resolving Obsolescence"
GCI Brochure 2018
DMSMS 2017 Poster for
DER™ and DEER™ Solutions
for Obsolescence
IMAPS 2018 Presentation "Successful FPGA Obsolescence Form, Fit & Function Solution
Using a MCM and DER™ to Implement Original
Logic Design"
GCI Pitch Deck 2017
DMSMS 2015 Poster
Presentation
GCI Quad Chart 2017
2015 IMAPS HiTEN
Conference-"Increased High-Tempe Reliability & Package
Hardening of Commercial
Integrated Circuits
"Advances in Die Extraction and
Re-Packaging for Obsolete
Semiconductors"
Teledyne Uses
Die Extraction to Save
DOD System
AFRL & GCI: DMSMS Die Extraction Repackaging (DER) Briefing DMSMS 2016
2014 CMSE- Die
Harvesting,
Mapping & Reassembly
to Avoid FPGA Based
System Redesign
NSWC Crane & GCI: A DMSMS Case Study 2016
Non--Destructive
Die Extraction and
Reassembly DER™
HiTEC 2016 Abstract
Review of Die Extraction
Increased High-Temperature IC Packaging Reliability Using Die Extraction and Additive Manufacturing Assembly
White Paper:
Bare Die Alternative
A DMSMS Case Study: A Qualified
Production IC Replacement for the X
24C04DMB using DER™ 2016
Frequently Asked
Questions
DMSMS GCI-DPACI Briefing 2015