TECHNOLOGY + SOLUTIONS

Reverse Engineering Solutions for Obsolescence

DER™ (Conventional Die Extraction & Re-packaging)

If one Package or Footprint is Obsolete, but the Needed Die can still be Located in Another Package Footprint, the Die can be Extracted and Re-packaged as Needed to meet the Target Footprint Requirement (DER™)

CERAMIC FLATPACK

PLASTIC PQFP

FRANCHISED DONOR IC DEVICE

OR THE DER™PROCESS

CAN BE USED TO

INVENTORY FUNCTIONAL DIE

MULTI-CHIP 

MODULE

EXTRACTED DIE

CERAMIC CQFP

GCI'S DER™ TECHNOLOGY UP CLOSE

EXTRACTION TECHNOLOGY PROVIDES VERY CLEAN FRONT-SIDE AND BACK-SIDE SURFACES

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DER™ RELIES ON CHEMICAL AND MECHANICAL PROCESSES WHICH ARE NO MORE AGGRESSIVE

THAN THOSE USED DURING WAFER FABRICATION

DIE BACK-SIDE SURFACE FREE OF CONTAMINANTS

AND RETURNED TO ORIGINAL MIRROR FINISH

 EXTREMELY CLEAN BOND PADS

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 NO INADVERTENT ETCHING

DIE SURFACE FREE OF 

CONTAMINANTS

Die Extraction and Re-packaging Considerations

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- What is the End Application? (Bare Die, Hybrid, Monolithic)

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-DER™ Flow: Original Package, Target Package Selections, Bond Map, Extraction, Re-Package, Test

New Bond Mapping Options for Same Die

- Multiple Chip Configurations for the Same Die Can Be Achieved with Optional Bondouts

-Plastic SOIC to Ceramic TSOP (Hermetic)

Franchised Donor SOIC

X-RAY IN Y DIRECTION

X-RAY IN

Z DIRECTION

EXTRACTED DIE

NEW BOND MAP

DIE ATTACHED

AND BONDED

FINAL CERAMIC

SOIC

Note 4 Bond Options For Conventional, Compound Bonding:

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Red:     Originally Non-Bonded Pad Still Not Bonded

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Green:  Originally Non-Bonded Pad Now Bonded

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Yellow:  Previously Bonded Pad Now Not Bonded

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Pink:     Previously Bonded Pad With a New Compound Bond

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What Sets GCI Apart?

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GCI has developed a proprietary technology superior to our

extraction re-packaging competitors.

DEER™ Reliability Improvements - Pad Re-Plating

Pad Re-Conditioning Using Gold Ball Removal Followed by ENEPIG

(Electroless Nickel, Electroless Palladium, Immersion Gold)  Die PatPlating

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-Potentially Poor Original Ball Bond Quality/Reliability is Removed

-Subsequent Bonding is Non-Compound with Highly Consistent and Reliable Bond Pull Strength

-New Bond Pad Surface Eliminates Possibility of Kirkendall Voiding with Gold Bond Wire at Operating Temperatures Above 150°C.

General Appearance of Kirkendall

or Horsting Voiding at Bond Pad

Location

Specifically, at Gold Ball to

Aluminum Bond Pad Interface, the

following Intermetallic Componds

can be formed:

Au5Al2,  Au4Al,  Au2Al,  AuAl2

ILLUSTRATION of ENEPIG

PAD PLATING

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OPTICAL PHOTO OF ACTUAL

ENEPIG PLATED DIE PAD

Process Flow for Re-Conditioning Following Extraction 

-Targeted Thickenesses: 4 um Ni, 0.25 um Pd, 0.04 um AU

DEER™ Gold Ball Removal, Pad Re-Plating, and Re-bonding 

with Electroless Ni/Pd/Au Process (ENEPIG)

Aluminum Pad Reconditioning for an Extracted Die (Target Total Plate Up is 4-5 um)

Technical Papers/Presentations

DMSMS 2018 Presentation "Obsolescence Solutions 

without System Redesign"

DMSMS 2018 Poster for

Authorized Reverse Engineered

Solutions for Obsolescence

DMSMS 2018 Poster for

Circuit Card Assembly

AA&S "Unique Solutions to Obsolete ICs Using Die Extraction and Repackaging DER™"

SMTA Electronics in Harsh Environments

Conference "Increasing High-Temperature Reliability of Plastic ICs Using Die Extraction

and Gold Ball Removal, and ENEPIG Die Pad Plating (DEER™)"

DMSMS 2017 Presentation "A How To Guide on Resolving Obsolescence"

GCI Brochure 2018

DMSMS 2017 Poster for

DER™ and DEER™ Solutions

for Obsolescence

IMAPS 2018 Presentation "Successful FPGA Obsolescence Form, Fit & Function Solution

Using a MCM and DER™ to Implement Original

Logic Design"

GCI Pitch Deck 2017

DMSMS 2015 Poster

Presentation

GCI Quad Chart 2017

2015 IMAPS HiTEN

Conference-"Increased High-Tempe Reliability & Package

Hardening of Commercial

Integrated Circuits

"Advances in Die Extraction and 

Re-Packaging for Obsolete

Semiconductors"

Teledyne Uses

Die Extraction to Save

DOD System

AFRL & GCI: DMSMS Die Extraction Repackaging (DER) Briefing DMSMS 2016

2014 CMSE- Die

Harvesting,

Mapping & Reassembly

to Avoid FPGA Based

System Redesign

NSWC Crane & GCI: A DMSMS Case Study  2016

Non--Destructive

Die Extraction and

Reassembly DER™

HiTEC 2016 Abstract

Review of Die Extraction

Increased High-Temperature IC Packaging Reliability Using Die Extraction and Additive Manufacturing Assembly

White Paper:

Bare Die Alternative

A DMSMS Case Study:  A Qualified

Production IC Replacement for the X

24C04DMB using DER™ 2016

Frequently Asked

Questions

DMSMS GCI-DPACI Briefing 2015