TECHNOLOGY + SOLUTIONS
Reverse Engineering Solutions for Obsolescence
DER™ (Conventional Die Extraction & Re-packaging)
If one Package or Footprint is Obsolete, but the Needed Die can still be Located in Another Package Footprint, the Die can be Extracted and Re-packaged as Needed to meet the Target Footprint Requirement (DER™)
CERAMIC FLATPACK
PLASTIC PQFP
FRANCHISED DONOR IC DEVICE
OR THE DER™PROCESS
CAN BE USED TO
INVENTORY FUNCTIONAL DIE
MULTI-CHIP
MODULE
EXTRACTED DIE
CERAMIC CQFP
GCI'S DER™ TECHNOLOGY UP CLOSE
EXTRACTION TECHNOLOGY PROVIDES VERY CLEAN FRONT-SIDE AND BACK-SIDE SURFACES
DER™ RELIES ON CHEMICAL AND MECHANICAL PROCESSES WHICH ARE NO MORE AGGRESSIVE
THAN THOSE USED DURING WAFER FABRICATION
DIE BACK-SIDE SURFACE FREE OF CONTAMINANTS
AND RETURNED TO ORIGINAL MIRROR FINISH
EXTREMELY CLEAN BOND PADS
NO INADVERTENT ETCHING
DIE SURFACE FREE OF
CONTAMINANTS
Die Extraction and Re-packaging Considerations
- What is the End Application? (Bare Die, Hybrid, Monolithic)
-DER™ Flow: Original Package, Target Package Selections, Bond Map, Extraction, Re-Package, Test
New Bond Mapping Options for Same Die
- Multiple Chip Configurations for the Same Die Can Be Achieved with Optional Bondouts
-Plastic SOIC to Ceramic TSOP (Hermetic)
Franchised Donor SOIC
X-RAY IN Y DIRECTION
X-RAY IN
Z DIRECTION
EXTRACTED DIE
NEW BOND MAP
DIE ATTACHED
AND BONDED
FINAL CERAMIC
SOIC
Note 4 Bond Options For Conventional, Compound Bonding:
Red: Originally Non-Bonded Pad Still Not Bonded
Green: Originally Non-Bonded Pad Now Bonded
Yellow: Previously Bonded Pad Now Not Bonded
Pink: Previously Bonded Pad With a New Compound Bond
What Sets GCI Apart?
GCI has developed a proprietary technology superior to our
extraction re-packaging competitors.
DEER™ Reliability Improvements - Pad Re-Plating
Pad Re-Conditioning Using Gold Ball Removal Followed by ENEPIG
(Electroless Nickel, Electroless Palladium, Immersion Gold) Die PatPlating
-Potentially Poor Original Ball Bond Quality/Reliability is Removed
-Subsequent Bonding is Non-Compound with Highly Consistent and Reliable Bond Pull Strength
-New Bond Pad Surface Eliminates Possibility of Kirkendall Voiding with Gold Bond Wire at Operating Temperatures Above 150°C.
General Appearance of Kirkendall
or Horsting Voiding at Bond Pad
Location
Specifically, at Gold Ball to
Aluminum Bond Pad Interface, the
following Intermetallic Componds
can be formed:
Au5Al2, Au4Al, Au2Al, AuAl2
ILLUSTRATION of ENEPIG
PAD PLATING
OPTICAL PHOTO OF ACTUAL
ENEPIG PLATED DIE PAD
Process Flow for Re-Conditioning Following Extraction
-Targeted Thickenesses: 4 um Ni, 0.25 um Pd, 0.04 um AU
DEER™ Gold Ball Removal, Pad Re-Plating, and Re-bonding
with Electroless Ni/Pd/Au Process (ENEPIG)
Aluminum Pad Reconditioning for an Extracted Die (Target Total Plate Up is 4-5 um)
Technical Papers/Presentations
SMTA Electronics in Harsh Environments
Conference "Increasing High-Temperature Reliability of Plastic ICs Using Die Extraction
and Gold Ball Removal, and ENEPIG Die Pad Plating (DEER™)"
AA&S "Unique Solutions to Obsolete ICs Using Die Extraction and Repackaging DER™"
DMSMS 2018 Presentation "Obsolescence Solutions
without System Redesign"
DMSMS 2018 Poster for
Authorized Reverse Engineered
Solutions for Obsolescence
DMSMS 2018 Poster for
Circuit Card Assembly
DMSMS 2017 Presentation "A How To Guide on Resolving Obsolescence"
GCI Brochure 2018
DMSMS 2017 Poster for
DER™ and DEER™ Solutions
for Obsolescence
IMAPS 2018 Presentation "Successful FPGA Obsolescence Form, Fit & Function Solution
Using a MCM and DER™ to Implement Original
Logic Design"
GCI Pitch Deck 2017
GCI Quad Chart 2017
"Advances in Die Extraction and
Re-Packaging for Obsolete
Semiconductors"
DMSMS 2015 Poster
Presentation
2015 IMAPS HiTEN
Conference-"Increased High-Tempe Reliability & Package
Hardening of Commercial
Integrated Circuits
Teledyne Uses
Die Extraction to Save
DOD System
AFRL & GCI: DMSMS Die Extraction Repackaging (DER) Briefing DMSMS 2016
2014 CMSE- Die
Harvesting,
Mapping & Reassembly
to Avoid FPGA Based
System Redesign
NSWC Crane & GCI: A DMSMS Case Study 2016
HiTEC 2016 Abstract
Increased High-Temperature IC Packaging Reliability Using Die Extraction and Additive Manufacturing Assembly
A DMSMS Case Study: A Qualified
Production IC Replacement for the X
24C04DMB using DER™ 2016
Non--Destructive
Die Extraction and
Reassembly DER™
Review of Die Extraction
White Paper:
Bare Die Alternative
Frequently Asked
Questions
DMSMS GCI-DPACI Briefing 2015