TECHNOLOGY + SOLUTIONS

Reverse Engineering Solutions for Obsolescence

DER (Conventional Die Extraction & Re-packaging)

If one Package or Footprint is Obsolete, but the Needed Die can still be Located in Another Package Footprint, the Die can be Extracted and Re-packaged as Needed to meet the Target Footprint Requirement (DER™)

CERAMIC FLATPACK

PLASTIC PQFP

FRANCHISED DONOR IC DEVICE

OR THE DERPROCESS

CAN BE USED TO

INVENTORY FUNCTIONAL DIE

MULTI-CHIP 

MODULE

EXTRACTED DIE

CERAMIC CQFP

GCI'S DER TECHNOLOGY UP CLOSE

EXTRACTION TECHNOLOGY PROVIDES VERY CLEAN FRONT-SIDE AND BACK-SIDE SURFACES

DER RELIES ON CHEMICAL AND MECHANICAL PROCESSES WHICH ARE NO MORE AGGRESSIVE

THAN THOSE USED DURING WAFER FABRICATION

DIE BACK-SIDE SURFACE FREE OF CONTAMINANTS

AND RETURNED TO ORIGINAL MIRROR FINISH

 EXTREMELY CLEAN BOND PADS

 NO INADVERTENT ETCHING

DIE SURFACE FREE OF 

CONTAMINANTS

Die Extraction and Re-packaging Considerations

- What is the End Application? (Bare Die, Hybrid, Monolithic)

-DERFlow: Original Package, Target Package Selections, Bond Map, Extraction, Re-Package, Test

New Bond Mapping Options for Same Die

- Multiple Chip Configurations for the Same Die Can Be Achieved with Optional Bondouts

-Plastic SOIC to Ceramic TSOP (Hermetic)

Franchised Donor SOIC

X-RAY IN Y DIRECTION

X-RAY IN

Z DIRECTION

EXTRACTED DIE

NEW BOND MAP

DIE ATTACHED

AND BONDED

FINAL CERAMIC

SOIC

Note 4 Bond Options For Conventional, Compound Bonding:

Red:     Originally Non-Bonded Pad Still Not Bonded

Green:  Originally Non-Bonded Pad Now Bonded

Yellow:  Previously Bonded Pad Now Not Bonded

Pink:     Previously Bonded Pad With a New Compound Bond

What Sets GCI Apart?

GCI has developed a proprietary technology superior to our

extraction re-packaging competitors.

DEER Reliability Improvements - Pad Re-Plating

Pad Re-Conditioning Using Gold Ball Removal Followed by ENEPIG

(Electroless Nickel, Electroless Palladium, Immersion Gold)  Die PatPlating

-Potentially Poor Original Ball Bond Quality/Reliability is Removed

-Subsequent Bonding is Non-Compound with Highly Consistent and Reliable Bond Pull Strength

-New Bond Pad Surface Eliminates Possibility of Kirkendall Voiding with Gold Bond Wire at Operating Temperatures Above 150°C.

General Appearance of Kirkendall

or Horsting Voiding at Bond Pad

Location

 

Specifically, at Gold Ball to

Aluminum Bond Pad Interface, the

following Intermetallic Componds

can be formed:

 

Au5Al2,  Au4Al,  Au2Al,  AuAl2

ILLUSTRATION of ENEPIG

PAD PLATING

OPTICAL PHOTO OF ACTUAL

ENEPIG PLATED DIE PAD

Process Flow for Re-Conditioning Following Extraction 

-Targeted Thickenesses: 4 um Ni, 0.25 um Pd, 0.04 um AU

DEER Gold Ball Removal, Pad Re-Plating, and Re-bonding 

with Electroless Ni/Pd/Au Process (ENEPIG)

Aluminum Pad Reconditioning for an Extracted Die (Target Total Plate Up is 4-5 um)

Technical Papers/Presentations

SMTA Electronics in Harsh Environments

Conference "Increasing High-Temperature Reliability of Plastic ICs Using Die Extraction

and Gold Ball Removal, and ENEPIG Die Pad Plating (DEER™)"

AA&S "Unique Solutions to Obsolete ICs Using Die Extraction and Repackaging DER™"

DMSMS 2018 Presentation "Obsolescence Solutions 

without System Redesign"

DMSMS 2018 Poster for

Authorized Reverse Engineered

Solutions for Obsolescence

DMSMS 2018 Poster for

Circuit Card Assembly

DMSMS 2017 Presentation "A How To Guide on Resolving Obsolescence"

GCI Brochure 2018

DMSMS 2017 Poster for

DERand DEER Solutions

for Obsolescence

IMAPS 2018 Presentation "Successful FPGA Obsolescence Form, Fit & Function Solution

Using a MCM and DER™ to Implement Original

Logic Design"

GCI Pitch Deck 2017

GCI Quad Chart 2017

"Advances in Die Extraction and 

Re-Packaging for Obsolete

Semiconductors"

DMSMS 2015 Poster

Presentation

2015 IMAPS HiTEN

Conference-"Increased High-Tempe Reliability & Package

Hardening of Commercial

Integrated Circuits

Teledyne Uses

Die Extraction to Save

DOD System

AFRL & GCI: DMSMS Die Extraction Repackaging (DER) Briefing DMSMS 2016

2014 CMSE- Die

Harvesting,

Mapping & Reassembly

to Avoid FPGA Based

System Redesign

NSWC Crane & GCI: A DMSMS Case Study  2016

HiTEC 2016 Abstract

Increased High-Temperature IC Packaging Reliability Using Die Extraction and Additive Manufacturing Assembly

A DMSMS Case Study:  A Qualified

Production IC Replacement for the X

24C04DMB using DER™ 2016

Non--Destructive

Die Extraction and

Reassembly DER

Review of Die Extraction

White Paper:

Bare Die Alternative

Frequently Asked

Questions

DMSMS GCI-DPACI Briefing 2015

4182 Center Park Drive

Colorado Springs, CO 80916

+1 719 573-6777

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