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Global Circuit Innovations (GCI) specializes in extracting semiconductor die from any plastic or ceramic IC package, and then reassembling those “removed” die into the IC package of our customer’s choice including rugged, hermetic packages or Multi Chip Modules (MCMs) or making that die available to our customers in “bare die” form if preferred.

 

4182 Center Park Drive

Colorado Springs, CO 80916

+1 719 573-6777

© 2020 GCI-GLOBAL