BARE DIE ALTERNATIVE

Electronic applications continue to drive smaller component footprints in order to reduce size and weight while increasing capability.  Specialty applications, like those in down-hole drilling, add the requirement of high temperature reliability.  One problem facing these industries is accessibility to integrated circuits available for use in multi chip module (MCM) products or readily packaged for extreme temperature applications (>150C).  In many cases, silicon functionality at target temperatures is acceptable, but the packaging precludes successful reliability integration within the end product, due to connectivity degradation over time at temperature.  Purchasing bare die for these applications is desired, but bare die are not generally available in small quantities, if at all.

 

Die extraction is an alternative method to supply die for various applications.  Extracted die can also be repackaged to successfully withstand extended use at 200C and beyond.  

 

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