HYBRID OR MULTICHIP MODULE (MCM SOLUTIONS

Global Circuit Innovations (GCI) performs process development as well as low to high volume IC assembly production using  “bare die” or “removed and reassembled die” or any combination thereof.  This is done for either single die per package (Single Chip Modules or SCMs) or multiple die per package (Multi Chip Modules or MCMs).

 

 

4815 List Drive, Suite 109

Colorado Springs, CO 80919

+1 719 573-6777

© 2021 GCI-GLOBAL