FPGA "FOOTPRINT" CONVERSION

There are applications where a customer needs an FPGA in a package footprint that was once available but is no longer available.  As long as these same die are available in any package, Global Circuit Innovations (GCI) can remove the desired die from the undesired package “footprint” and reassemble the die into the desired package “footprint” thus providing an FPGA “footprint conversion.”

 

Also there are occasions when a customer would like to switch from one FPGA supplier to a different FPGA supplier.  In these cases, Global Circuit Innovations (GCI) can remove the die from the undesired package “footprint” and reassemble it into the desired package “footprint” thus providing an FPGA “footprint conversion.”  In this manner, no PCB redesign is required.  Of course, the programming for the new FPGA manufacturer needs to be performed, but this can be done and has been done successfully.

 

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