What GCI Offers

DIE REMOVAL
What We Offer – Advanced Extraction Solutions (AES) - Die in the Desired Packages or Die in Bare Die Form
GCI has developed an advanced, non-destructive, die-extraction technique through our Advanced Extraction Solutions (AES) product line that allows us to remove a die from any semiconductor package making that die available in bare die form to be repackaged in any other available package or used in bare die form.