DIE AND PACKAGE THINNING

Global Circuit Innovations (GCI) has the highly-specialized equipment and expertise to thin die and IC packages.  Low profile applications, such as die that are removed and reassembled into lower-profile packages or “stacked die” often require die thinning.  GCI can thin die down to a thickness of 3 mils (or 75μM), if required.

Where are lower-profile IC packages are required, GCI can thin packages as well as die.

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