DIE AND PACKAGE THINNING
Global Circuit Innovations (GCI) has the highly-specialized equipment and expertise to thin die and IC packages. Low profile applications, such as die that are removed and reassembled into lower-profile packages or “stacked die” often require die thinning. GCI can thin die down to a thickness of 3 mils (or 75μM), if required.
Where are lower-profile IC packages are required, GCI can thin packages as well as die.