
HIGH TEMPERATURE ENVIRONMENTS
Gold Ball Removal, Pad Re-Plating with
Electroless Ni/Pd/Au (ENEPIG) DEER™ Process
Procure Commercial IC, Extract Die, Complete Gold Ball Remnant Removal -
Gold or Aluminum Wire Bond Following ENEPIG Die Pad Plating for High Temperature Applications

Aluminum Pad Reconditioning for an Extracted Die (Target Total Plate Up is 4 - 5 um)
GCI’s DEER™ Gold Ball Removal with ENEPIG Die Pad Plating
Relative 250°C Lifetest Performance

Packaging Option Key:
1 – Standard Plastic - Baseline -25 hour
2 – Extraction, Standard Ceramic Assembly - DER™ -95 hour
3 – Extraction, Hi-Temp Ceramic Assembly - DER™ -600 hour
4 – Extraction, Ni/Pd/Au Process, Standard Ceramic Assembly - DEER™ - +6000 hour
5 – Extraction, Ni/Pd/Au Process, Hi-Temp Ceramic Assembly - DEER™ - +6000 hour
GCI’s DEER™ Process Improvements
•Pad Re-Conditioning Using Gold Ball Removal Followed by ENEPIG
(Electroless Nickel, Electroless Palladium, Immersion Gold) Plating
• Potential Original Poor Ball Bond Quality/Reliability is Removed
• Subsequent Bonding is Non-Compound with Highly Consistent and Reliable Bond Pull Strength
• New Bond Pad Surface Eliminates Possibility of Kirkendall Voiding with Gold Bond Wire at Operating Temperatures Above 150°C

General Appearance of Kirkendall or Horsting Voiding at Bond Pad Location
Specifically, at Gold Ball to Aluminum Bond Pad Interface, the following Intermetallic Compounds can be formed:
Au5Al2, Au4Al, Au2Al, AuAl2
For a more in depth overview of our technology, click here.

Illustration of ENEPIG Pad Plating

Optical Photo of Actual ENEPIG
Plated Die Pad