Gold Ball Removal, Pad Re-Plating with

Electroless Ni/Pd/Au (ENEPIG)  DEER™ Process

Procure Commercial IC, Extract Die, Complete Gold Ball Remnant Removal - 

Gold or Aluminum Wire Bond Following ENEPIG Die Pad  Plating for High Temperature Applications

Aluminum Pad Reconditioning for an Extracted Die (Target Total Plate Up is 4 - 5 um)

GCI’s DEER™ Gold Ball Removal with ENEPIG  Die Pad Plating

Relative 250°C Lifetest Performance

Packaging Option Key:

1 – Standard Plastic                                                                                            - Baseline       -25 hour

2 – Extraction, Standard Ceramic Assembly                                                   - DER™            -95 hour

3 – Extraction, Hi-Temp Ceramic Assembly                                                     - DER™           -600 hour

4 – Extraction, Ni/Pd/Au Process, Standard Ceramic Assembly                   - DEER™         - +6000 hour

5 – Extraction, Ni/Pd/Au Process, Hi-Temp Ceramic Assembly                    - DEER™         - +6000 hour

GCI’s DEER™ Process Improvements​

•Pad Re-Conditioning Using Gold Ball Removal Followed by ENEPIG  

  (Electroless Nickel, Electroless Palladium, Immersion Gold) Plating

•   Potential Original Poor Ball Bond Quality/Reliability is Removed

•   Subsequent Bonding is Non-Compound with Highly Consistent and Reliable Bond Pull Strength

•   New Bond Pad Surface Eliminates Possibility of Kirkendall Voiding with Gold Bond Wire at     Operating Temperatures Above 150°C

General Appearance of Kirkendall or Horsting Voiding at Bond Pad Location


Specifically, at Gold Ball to Aluminum Bond Pad Interface, the following Intermetallic Compounds can be formed:

Au5Al2,  Au4Al,  Au2Al,  AuAl2

For a more in depth overview of our technology, click here.

Illustration of ENEPIG Pad Plating

Optical Photo of Actual ENEPIG

Plated Die Pad

4815 List Drive, Suite 109

Colorado Springs, CO 80919

+1 719 573-6777