
IC Solutions for Obsolescence
Commercial and Department of Defense (DoD) IC Obsolescence Solutions
Typical GCI Re-manufactured Part Process Flow using our proprietary DER™ and DEER™ Technology
If one Package Footprint is Obsolete, but the Die can still be Located in Another Package Footprint, the Die can be Extracted and Re-assembled into the Desired Footprint
Commercial PAL
MIL-STD PAL
NAVAIR OBSOLETE IC
DONOR IC
GCI REMANUFACTURED IC



5962-860530KA
24 pin plastic SOIC
PAL22V10-15PC
24 pin PDIP- 300 mil wide
Purchased from Franchised Distributor
GCIPAL22V10BA
24pin Hermetic SOIC
Qualified IAW 5962-8605302KA
•GCI’s DER™ and DEER™ provides a game-changing solution using franchised donor ICs to resolve
IC obsolescence issues
•GCI has provided DER™ and DEER™ solutions for many DoD customers and, in each case, the final IC has passed full MIL-STD-883 QCI testing
For a more in depth overview of our technology, click here.