CUSTOM IC ASSEMBLY SOLUTIONS

Using our extensive breadth of semiconductor assembly experience, Global Circuit Innovations (GCI) can solve your most challenging IC assembly requirements.  GCI’s onsite assembly capacity can handle low to high volume IC assembly production using  “bare die” or “removed and reassembled die” or any combination thereof.

 

Contact Global Circuit Innovations to discuss your needs.

 

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4182 Center Park Drive

Colorado Springs, CO 80916

+1 719 573-6777

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