September 26th, 2019
Global Circuit Innovations Video
Erick Spory presented at the 22nd Microelectronics and Packaging Conference (EMPC) and Exhibition September 17th 2019 in Pisa, Italy.
Mr. Spory presented "High-Temperature Inter-Cavity Silicon Interposer Substrate for Multi-Chip Module Assembly" to a full audience.
EMPC-2019 in Pisa offers the best of microelectronics packaging and interconnection technologies, providing top quality coverage of technological innovation in this field.
This is the established international forum for engineers working in the field and others wanting to learn from this leading event.